EB13E2H2H-4.000M TR

EB13E2H2H-4.000M REGULATORY COMPLIANCE (Data Sheet downloaded on Sep 22, 2020) 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 2.5mm x 3.2mm Ceramic Surface Mount (SMD) 4.000MHz ±50ppm over -40°C to +85°C ELECTRICAL SPECIFICATIONS Nominal Frequency 4.000MHz Frequency Tolerance/Stability ±50ppm Maximum over -40°C to +85°C (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C, Shock, and Vibration) Supply Voltage 3.3Vdc ±5% Input Current 3mA Maximum Output Voltage Logic High (Voh) 90% of Vdd Minimum (IOH= -4mA) Output Voltage Logic Low (Vol) 10% of Vdd Maximum (IOL= +4mA) Rise/Fall Time 5nSec Maximum (Measured at 20% to 80% of waveform) Duty Cycle 50 ±5(%) (Measured at 50% of waveform) Load Drive Capability 15pF Maximum Output Logic Type CMOS Pin 1 Connection Tri-State (High Impedance) Tri-State Input Voltage (Vih and Vil) 80% of Vdd Minimum or No Connect to Enable Output, 20% of Vdd Maximum to Disable Output (High Impedance) Standby Current 10µA Maximum (Disabled Output: High Impedance) RMS Phase Jitter 1pSec Maximum (Fj = 12kHz to 20MHz) Start Up Time 10mSec Maximum Storage Temperature Range -55°C to +125°C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Revision O 12/05/2014 | Page 1 of 6 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EB13E2H2H-4.000M MECHANICAL DIMENSIONS (all dimensions in millimeters) 2.50 ±0.15 0.75 ±0.10 MARKING ORIENTATION 2 3.20 ±0.15 3 1.00 ±0.10 PIN CONNECTION 1 Tri-State 2 Case/Ground 3 Output 4 Supply Voltage LINE MARKING 1.20 ±0.10 1 0.90 ±0.20 4 1 E4.00 E=Ecliptek Designator 2 XXXXX XXXXX=Ecliptek Manufacturing Identifier 1.00 ±0.10 Suggested Solder Pad Layout All Dimensions in Millimeters 1.10 (X4) 1.30 (X4) Solder Land (X4) 1.00 0.80 All Tolerances are ±0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision O 12/05/2014 | Page 2 of 6 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EB13E2H2H-4.000M CLOCK OUTPUT TRI-STATE INPUT OUTPUT WAVEFORM & TIMING DIAGRAM VIH VIL VOH 80% of Waveform OUTPUT DISABLE (HIGH IMPEDANCE STATE) 50% of Waveform 20% of Waveform VOL tPLZ Fall Time Rise Time tPZL TW T Duty Cycle (%) = TW/T x 100 www.ecliptek.com | Specification Subject to Change Without Notice | Revision O 12/05/2014 | Page 3 of 6 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EB13E2H2H-4.000M Test Circuit for CMOS Output Frequency Counter Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Probe (Note 2) Output + Voltage Meter _ 0.01µF (Note 1) 0.1µF (Note 1) Ground CL (Note 3) Tri-State Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low capacitance (10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. www.ecliptek.com | Specification Subject to Change Without Notice | Revision O 12/05/2014 | Page 4 of 6 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EB13E2H2H-4.000M Recommended Solder Reflow Methods High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5°C of actual peak (tp) Ramp-down Rate Time 25°C to Peak Temperature (t) Moisture Sensitivity Level 3°C/Second Maximum 150°C 175°C 200°C 60 - 180 Seconds 3°C/Second Maximum 217°C 60 - 150 Seconds 260°C Maximum for 10 Seconds Maximum 250°C +0/-5°C 20 - 40 Seconds 6°C/Second Maximum 8 Minutes Maximum Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision O 12/05/2014 | Page 5 of 6 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EB13E2H2H-4.000M Recommended Solder Reflow Methods Low Temperature Infrared/Convection 240°C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5°C of actual peak (tp) Ramp-down Rate Time 25°C to Peak Temperature (t) Moisture Sensitivity Level 5°C/Second Maximum N/A 150°C N/A 60 - 120 Seconds 5°C/Second Maximum 150°C 200 Seconds Maximum 240°C Maximum 240°C Maximum 2 Times / 230°C Maximum 1 Time 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time 5°C/Second Maximum N/A Level 1 Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Revision O 12/05/2014 | Page 6 of 6 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200